ISSN 1551-4897
Vol. 4, Issue 3, 2007July 01, 2007 EDT
Design and Optimization of Piezoelectric Fans for Cooling of Microelectronic Devices
Design and Optimization of Piezoelectric Fans for Cooling of Microelectronic Devices
Maram Venkata Ramana, Indra Putra Almanar, Mohd Zulkifly Abdullah, Zaidi Mohd Ripin, K.N. Seetaramu,
Articles in Vol. 4, Issue 3, 2007
Vol. 4, Issue 3, 2007
- High-Temperature Spin-On Adhesives for Temporary Wafer BondingS. PillalamarriR. PuligaddaC. BrubakerM. WimplingerS. Pargfrieder
- Failure Analysis of Lead-Free Solder Joints of an 1657CCGA (Ceramic Column Grid Array) PackageJohn LauTodd CastelloDongkai ShangguanWalter DauksherJoe SmetanaRob HorsleyDave LoveIrv MenisBob Sullivan
- Design and Optimization of Piezoelectric Fans for Cooling of Microelectronic DevicesMaram Venkata RamanaIndra Putra AlmanarMohd Zulkifly AbdullahZaidi Mohd RipinK.N. Seetaramu
- New Sacrificial Layer-Based Screen-Printing Process for Free-Standing Thick-Films Applied to MEMSClaude LucatPatrick GinetFrancis Ménil
- Nanoceramic Processing for High-Power Multi-channel Electron Multiplier in Low Temperature Cofire Ceramic (LTCC)Feng ZhengW. Kinzy JonesWenzhong WuRaghunandan Seelaboyina
- Comparison of High-Resolution Patterning Technologies for LTCC Microwave CircuitsJ. MüllerR. PerroneK.-H. DrüeR. StephanJ. TrabertM. HeinD. SchwankeJ. PohlnerG. ReppeR. KulkeP. UhligA.F. JacobT. BarasA. Molke
Ramana, Maram Venkata, Indra Putra Almanar, Mohd Zulkifly Abdullah, Zaidi Mohd Ripin, and K.N. Seetaramu. 2007. “Design and Optimization of Piezoelectric Fans for Cooling of Microelectronic Devices.” Journal of Microelectronics and Electronic Packaging 4 (3): 121–29. https://doi.org/10.4071/1551-4897-4.3.121.