ISSN 1551-4897
Vol. 4, Issue 2, 2007April 01, 2007 EDT
Suppression of SSN by Embedded Decoupling Capacitor in LTCC Package
Suppression of SSN by Embedded Decoupling Capacitor in LTCC Package
Articles in Vol. 4, Issue 2, 2007
Vol. 4, Issue 2, 2007
- Improvement of High-Temperature Reliability of Ball Bond Using Platinum-Modified Gold Alloy WiresKazunari MakiYuji NakataMasayoshi NagaoAkifumi Mishima
- Suppression of SSN by Embedded Decoupling Capacitor in LTCC PackageYun-Hwi ParkKwangje OhIkseop KimHosung ChuJehong SungSeokchul YunJinwaun Kim
- Investigation of the Lead-free Solder Joint Shear PerformanceJames WebsterJianbiao PanBrian J. Toleno
- LTCC Enzymatic MicroreactorKarol MalechaDorota PijanowskaLeszek GolonkaWladyslaw Torbicz
- Single Sample Cylinder for RGA CorrelationPhilipp wh SchuesslerDaniel J. RossiterRobert K. LowrySheryl M. Sierzant
- Development of High Reliability Via on IVH (VONI) for High Density Interconnect Circuit BoardsJong-Won ParkYun-Seok HwangIl-Kyoon JeunDa-Hee JoungMyung-Gun ChongDek-jin Yang
Park, Yun-Hwi, Kwangje Oh, Ikseop Kim, Hosung Chu, Jehong Sung, Seokchul Yun, and Jinwaun Kim. 2007. “Suppression of SSN by Embedded Decoupling Capacitor in LTCC Package.” Journal of Microelectronics and Electronic Packaging 4 (2): 57–63. https://doi.org/10.4071/1551-4897-4.2.57.