ISSN 1551-4897
Vol. 4, Issue 2, 2007April 01, 2007 EDT
Investigation of the Lead-free Solder Joint Shear Performance
Investigation of the Lead-free Solder Joint Shear Performance
Articles in Vol. 4, Issue 2, 2007
Vol. 4, Issue 2, 2007
- Improvement of High-Temperature Reliability of Ball Bond Using Platinum-Modified Gold Alloy WiresKazunari MakiYuji NakataMasayoshi NagaoAkifumi Mishima
- Suppression of SSN by Embedded Decoupling Capacitor in LTCC PackageYun-Hwi ParkKwangje OhIkseop KimHosung ChuJehong SungSeokchul YunJinwaun Kim
- Investigation of the Lead-free Solder Joint Shear PerformanceJames WebsterJianbiao PanBrian J. Toleno
- LTCC Enzymatic MicroreactorKarol MalechaDorota PijanowskaLeszek GolonkaWladyslaw Torbicz
- Single Sample Cylinder for RGA CorrelationPhilipp wh SchuesslerDaniel J. RossiterRobert K. LowrySheryl M. Sierzant
- Development of High Reliability Via on IVH (VONI) for High Density Interconnect Circuit BoardsJong-Won ParkYun-Seok HwangIl-Kyoon JeunDa-Hee JoungMyung-Gun ChongDek-jin Yang
Webster, James, Jianbiao Pan, and Brian J. Toleno. 2007. “Investigation of the Lead-Free Solder Joint Shear Performance.” Journal of Microelectronics and Electronic Packaging 4 (2): 72–77. https://doi.org/10.4071/1551-4897-4.2.72.