ISSN 1551-4897
Vol. 4, Issue 1, 2007January 01, 2007 EDT
Transient Thermal Characterization of a Stacked Multichip Package
Transient Thermal Characterization of a Stacked Multichip Package
Articles in Vol. 4, Issue 1, 2007
Vol. 4, Issue 1, 2007
- A Novel Scheme for Wide Bandwidth Chip-to-Chip CommunicationsQing LiuPatrick FayGary H. Bernstein
- Micromachined LCP Connectors for Packaging MEMS Devices in Biological EnvironmentsRobert DeanJenny WellerMike BozackBrian FarrellLinas JauniskisJoseph TingDavid EdellJamille Hetke
- Miniature Multi-electrode Electrochemical Cell in LTCCJohn YoungsmanBrian MarxScott WolterJeff GlassAmy Moll
- Transient Thermal Characterization of a Stacked Multichip PackageKimmo KaijaPekka Heino
- Fatigue Assessment of Solder Bumps on Board Assemblies Affected by PWB WarpageWei TanI. Charles Ume
- Effect of Silane Functional Group on Adhesion of Selected Epoxies for Microelectronic PackagingM. Jenkins BorregoR. H. DauskardtJ. C. Bravman
Kaija, Kimmo, and Pekka Heino. 2007. “Transient Thermal Characterization of a Stacked Multichip Package.” Journal of Microelectronics and Electronic Packaging 4 (1): 23–30. https://doi.org/10.4071/1551-4897-4.1.23.