ISSN 1551-4897
Vol. 4, Issue 1, 2007January 01, 2007 EDT
A Novel Scheme for Wide Bandwidth Chip-to-Chip Communications
A Novel Scheme for Wide Bandwidth Chip-to-Chip Communications
Articles in Vol. 4, Issue 1, 2007
Vol. 4, Issue 1, 2007
- A Novel Scheme for Wide Bandwidth Chip-to-Chip CommunicationsQing LiuPatrick FayGary H. Bernstein
- Micromachined LCP Connectors for Packaging MEMS Devices in Biological EnvironmentsRobert DeanJenny WellerMike BozackBrian FarrellLinas JauniskisJoseph TingDavid EdellJamille Hetke
- Miniature Multi-electrode Electrochemical Cell in LTCCJohn YoungsmanBrian MarxScott WolterJeff GlassAmy Moll
- Transient Thermal Characterization of a Stacked Multichip PackageKimmo KaijaPekka Heino
- Fatigue Assessment of Solder Bumps on Board Assemblies Affected by PWB WarpageWei TanI. Charles Ume
- Effect of Silane Functional Group on Adhesion of Selected Epoxies for Microelectronic PackagingM. Jenkins BorregoR. H. DauskardtJ. C. Bravman
Liu, Qing, Patrick Fay, and Gary H. Bernstein. 2007. “A Novel Scheme for Wide Bandwidth Chip-to-Chip Communications.” Journal of Microelectronics and Electronic Packaging 4 (1): 1–7. https://doi.org/10.4071/1551-4897-4.1.1.