Vol. 3, Issue 3, 2006July 01, 2006 EDT
LTCC Microsystems and Microsystem Packaging and Integration Applications
LTCC Microsystems and Microsystem Packaging and Integration Applications
Peterson, K.A., K.D. Patel, C.K. Ho, B.R. Rohrer, C.D. Nordquist, B.D. Wroblewski, and K.B. Pfeifer. 2006. “LTCC Microsystems and Microsystem Packaging and Integration Applications.” Journal of Microelectronics and Electronic Packaging 3 (3): 109–20. https://doi.org/10.4071/1551-4897-3.3.109.