ISSN 1551-4897
Vol. 3, Issue 3, 2006July 01, 2006 EDT
Three-dimensional fluidic microsystem fabricated in Low Temperature Cofired Ceramic Technology
Three-dimensional fluidic microsystem fabricated in Low Temperature Cofired Ceramic Technology
Articles in Vol. 3, Issue 3, 2006
Vol. 3, Issue 3, 2006
- Analysis of A Larger Die, Copper Pillar Bump Flip Chip Package with No-Flow UnderfillXiaowu ZhangD. PinjalaE. H. WongGrace ChewZhaohui MaTeck Tiong TanJimmy Chew
- Fabrication of Conductors and Inductors by Nano-Particle Deposition through Direct Write TechnologyJacob ColvinMichael CarterJames Sears
- LTCC Microsystems and Microsystem Packaging and Integration ApplicationsK.A. PetersonK.D. PatelC.K. HoB.R. RohrerC.D. NordquistB.D. WroblewskiK.B. Pfeifer
- An LTCC Based Filter and Front End Module using Heterogeneous DielectricsJun Chul KimDongsu KimHyun Min ChoJong Chul ParkNam Kee Kang
- Three-dimensional fluidic microsystem fabricated in Low Temperature Cofired Ceramic TechnologyLeszek J. GolonkaTomasz ZawadaHenryk RoguszczakKarol MalechaMichal ChudyDorota StadnikArtur Dybko
- Development of LTCC Smart Channels for Integrated Chemical, Temperature, and Flow SensingClifford K. HoKenneth A. PetersonLucas K. McGrathTimothy S. Turner
- Low Temperature Cofired Ceramic Microfluidic Microsystems for High Temperature and High Pressure ApplicationsKamlesh D. PatelKenneth A. PetersonKyle W. Hukari
Golonka, Leszek J., Tomasz Zawada, Henryk Roguszczak, Karol Malecha, Michal Chudy, Dorota Stadnik, and Artur Dybko. 2006. “Three-Dimensional Fluidic Microsystem Fabricated in Low Temperature Cofired Ceramic Technology.” Journal of Microelectronics and Electronic Packaging 3 (3): 145–51. https://doi.org/10.4071/1551-4897-3.3.145.