ISSN 1551-4897
Vol. 3, Issue 3, 2006July 01, 2006 EDT
Analysis of A Larger Die, Copper Pillar Bump Flip Chip Package with No-Flow Underfill
Analysis of A Larger Die, Copper Pillar Bump Flip Chip Package with No-Flow Underfill
Articles in Vol. 3, Issue 3, 2006
Vol. 3, Issue 3, 2006
- Analysis of A Larger Die, Copper Pillar Bump Flip Chip Package with No-Flow UnderfillXiaowu ZhangD. PinjalaE. H. WongGrace ChewZhaohui MaTeck Tiong TanJimmy Chew
- Fabrication of Conductors and Inductors by Nano-Particle Deposition through Direct Write TechnologyJacob ColvinMichael CarterJames Sears
- LTCC Microsystems and Microsystem Packaging and Integration ApplicationsK.A. PetersonK.D. PatelC.K. HoB.R. RohrerC.D. NordquistB.D. WroblewskiK.B. Pfeifer
- An LTCC Based Filter and Front End Module using Heterogeneous DielectricsJun Chul KimDongsu KimHyun Min ChoJong Chul ParkNam Kee Kang
- Three-dimensional fluidic microsystem fabricated in Low Temperature Cofired Ceramic TechnologyLeszek J. GolonkaTomasz ZawadaHenryk RoguszczakKarol MalechaMichal ChudyDorota StadnikArtur Dybko
- Development of LTCC Smart Channels for Integrated Chemical, Temperature, and Flow SensingClifford K. HoKenneth A. PetersonLucas K. McGrathTimothy S. Turner
- Low Temperature Cofired Ceramic Microfluidic Microsystems for High Temperature and High Pressure ApplicationsKamlesh D. PatelKenneth A. PetersonKyle W. Hukari
Zhang, Xiaowu, D. Pinjala, E. H. Wong, Grace Chew, Zhaohui Ma, Teck Tiong Tan, and Jimmy Chew. 2006. “Analysis of A Larger Die, Copper Pillar Bump Flip Chip Package with No-Flow Underfill.” Journal of Microelectronics and Electronic Packaging 3 (3): 100–108. https://doi.org/10.4071/1551-4897-3.3.100.