ISSN 1551-4897
Articles in Vol. 3, Issue 1, 2006
Vol. 3, Issue 1, 2006
- Effect of Compatibility between Fluxes and Cyanate Ester Underfill on Lead Free Flip Chip Assembly and ReliabilityRaghunandan ChawareLeon StiborekJeremias LibresManots MarquezCharles OdegardMarvin CowensMuthiah Venkateswaran
- Ball Bonding Process Robustification with regard to Space ApplicationsS.P. LibonP. PaelinckB. Goffin
- Electro-migration behavior of Pb-free Flip Chip BumpsRiet LabieTomas WebersBart SwinnenEric Beyne
- Properties and Stability of Thick-Film Resistors with Low Processing Temperatures - Effect of Composition and Processing ParametersSonia Menot-VionnetThomas MaederClaudio GrimaldiCaroline JacqPeter Ryser
- Electrical Characterization of High Performance Memory FBGA BOC PackageM. GospodinovaG. NanJ. ThomasR. SubrayaJ. Held
- Novel Method of Separating Probe and Wire Bond Regions without Increasing Die Size and Reducing Weak Fab-Back End of Line Adhesion InterfacesChu-Chung (Stephen) LeeTu Anh TranBill WilliamsJody Ross
Labie, Riet, Tomas Webers, Bart Swinnen, and Eric Beyne. 2006. “Electro-Migration Behavior of Pb-Free Flip Chip Bumps.” Journal of Microelectronics and Electronic Packaging 3 (1): 32–36. https://doi.org/10.4071/1551-4897-3.1.32.