ISSN 1551-4897
Vol. 3, Issue 1, 2006January 01, 2006 EDT
Effect of Compatibility between Fluxes and Cyanate Ester Underfill on Lead Free Flip Chip Assembly and Reliability
Effect of Compatibility between Fluxes and Cyanate Ester Underfill on Lead Free Flip Chip Assembly and Reliability
Articles in Vol. 3, Issue 1, 2006
Vol. 3, Issue 1, 2006
- Effect of Compatibility between Fluxes and Cyanate Ester Underfill on Lead Free Flip Chip Assembly and ReliabilityRaghunandan ChawareLeon StiborekJeremias LibresManots MarquezCharles OdegardMarvin CowensMuthiah Venkateswaran
- Ball Bonding Process Robustification with regard to Space ApplicationsS.P. LibonP. PaelinckB. Goffin
- Electro-migration behavior of Pb-free Flip Chip BumpsRiet LabieTomas WebersBart SwinnenEric Beyne
- Properties and Stability of Thick-Film Resistors with Low Processing Temperatures - Effect of Composition and Processing ParametersSonia Menot-VionnetThomas MaederClaudio GrimaldiCaroline JacqPeter Ryser
- Electrical Characterization of High Performance Memory FBGA BOC PackageM. GospodinovaG. NanJ. ThomasR. SubrayaJ. Held
- Novel Method of Separating Probe and Wire Bond Regions without Increasing Die Size and Reducing Weak Fab-Back End of Line Adhesion InterfacesChu-Chung (Stephen) LeeTu Anh TranBill WilliamsJody Ross
Chaware, Raghunandan, Leon Stiborek, Jeremias Libres, Manots Marquez, Charles Odegard, Marvin Cowens, and Muthiah Venkateswaran. 2006. “Effect of Compatibility between Fluxes and Cyanate Ester Underfill on Lead Free Flip Chip Assembly and Reliability.” Journal of Microelectronics and Electronic Packaging 3 (1): 12–21. https://doi.org/10.4071/1551-4897-3.1.12.