ISSN 1551-4897
Vol. 17, Issue 3, 2020July 01, 2020 EDT
Development of High Thermally Conductive Die Attach for TIM Applications
Development of High Thermally Conductive Die Attach for TIM Applications
Articles in Vol. 17, Issue 3, 2020
Vol. 17, Issue 3, 2020
- A New Halogen-Free Parylene for High Performance and Reliability of Microelectronics in Harsh EnvironmentsRakesh KumarFrank KeDustin EnglandAngie SummersLamar Young
- Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous IntegrationJohn H. LauCheng-Ta KoChia-Yu PengKai-Ming YangTim XiaPuru Bruce LinJean-Jou ChenPo-Chun HuangTzvy-Jang TsengEagle LinLeo ChangCurry LinWinnie Lu
- High-Density Interconnect Technology Assessment of Printed Circuit Boards for Space ApplicationsMaarten CauweBart VandeveldeChinmay NawghaneMarnix Van De SlyekeErwin BosmanJoachim VerheggeAlexia CoulonStan Heltzel
- High-Temperature Double-Layer Ceramic Packaging SubstratesArdalan NasiriSimon S. Ang
- Development of High Thermally Conductive Die Attach for TIM ApplicationsMaciej PatelkaSho IkedaKoji SasakiHiroki MyodoNortisuka Mizumura
Patelka, Maciej, Sho Ikeda, Koji Sasaki, Hiroki Myodo, and Nortisuka Mizumura. 2020. “Development of High Thermally Conductive Die Attach for TIM Applications.” Journal of Microelectronics and Electronic Packaging 17 (3): 106–9. https://doi.org/10.4071/imaps.1125402.