ISSN 1551-4897
Vol. 17, Issue 2, 2020April 01, 2020 EDT
Fabrication of Ceramic Interposers for Module Packaging
Fabrication of Ceramic Interposers for Module Packaging
Articles in Vol. 17, Issue 2, 2020
Vol. 17, Issue 2, 2020
- Ferrites in Transfer-Molded Power SiPs: Challenges in PackagingTina ThomasMarius van DijkMarc DreissigackerStefan HoffmannHans WalterKarl-Friedrich BeckerMartin Schneider-Ramelow
- High-Temperature Electronics Packaging for Simulated Venus ConditionArdalan NasiriSimon S. AngTom CannonErrol V. PorterKaoru Uema PorterCaitlin ChapinRuiqi ChenDebbie G. Senesky
- Assembly of Cu Wirings with Ultrasmooth and High-Adhesive Electroless Cu Seed Layer by Using UV Modification and Low Attenuation of High-Frequency Transmission PropertyMasaya TobaShuji NomotoNobuhito KomuroKazuyuki MitsukuraShinichiro AbeTakashi MasukoKazuhiko Kurafuchi
- A Wirebonding Instrument for Insulated and Coaxial WiresMitchell MeinholdCaprice GrayJeffery DelisioErnest KimChristian WellsDaniela TorresPeter LewisDavid Hagerstrom
- Fabrication of Ceramic Interposers for Module PackagingRana AlizadehKaoru Uema PorterTom CannonH. Alan Mantooth
Alizadeh, Rana, Kaoru Uema Porter, Tom Cannon, and H. Alan Mantooth. 2020. “Fabrication of Ceramic Interposers for Module Packaging.” Journal of Microelectronics and Electronic Packaging 17 (2): 67–72. https://doi.org/10.4071/imaps.1114553.