ISSN 1551-4897
Vol. 17, Issue 2, 2020April 01, 2020 EDT
Assembly of Cu Wirings with Ultrasmooth and High-Adhesive Electroless Cu Seed Layer by Using UV Modification and Low Attenuation of High-Frequency Transmission Property
Assembly of Cu Wirings with Ultrasmooth and High-Adhesive Electroless Cu Seed Layer by Using UV Modification and Low Attenuation of High-Frequency Transmission Property
Masaya Toba, Shuji Nomoto, Nobuhito Komuro, Kazuyuki Mitsukura, Shinichiro Abe, Takashi Masuko, Kazuhiko Kurafuchi,
Articles in Vol. 17, Issue 2, 2020
Vol. 17, Issue 2, 2020
- Ferrites in Transfer-Molded Power SiPs: Challenges in PackagingTina ThomasMarius van DijkMarc DreissigackerStefan HoffmannHans WalterKarl-Friedrich BeckerMartin Schneider-Ramelow
- High-Temperature Electronics Packaging for Simulated Venus ConditionArdalan NasiriSimon S. AngTom CannonErrol V. PorterKaoru Uema PorterCaitlin ChapinRuiqi ChenDebbie G. Senesky
- Assembly of Cu Wirings with Ultrasmooth and High-Adhesive Electroless Cu Seed Layer by Using UV Modification and Low Attenuation of High-Frequency Transmission PropertyMasaya TobaShuji NomotoNobuhito KomuroKazuyuki MitsukuraShinichiro AbeTakashi MasukoKazuhiko Kurafuchi
- A Wirebonding Instrument for Insulated and Coaxial WiresMitchell MeinholdCaprice GrayJeffery DelisioErnest KimChristian WellsDaniela TorresPeter LewisDavid Hagerstrom
- Fabrication of Ceramic Interposers for Module PackagingRana AlizadehKaoru Uema PorterTom CannonH. Alan Mantooth
Toba, Masaya, Shuji Nomoto, Nobuhito Komuro, Kazuyuki Mitsukura, Shinichiro Abe, Takashi Masuko, and Kazuhiko Kurafuchi. 2020. “Assembly of Cu Wirings with Ultrasmooth and High-Adhesive Electroless Cu Seed Layer by Using UV Modification and Low Attenuation of High-Frequency Transmission Property.” Journal of Microelectronics and Electronic Packaging 17 (2): 45–51. https://doi.org/10.4071/imaps.1100914.