ISSN 1551-4897
Articles in Vol. 16, Issue 1, 2019
Vol. 16, Issue 1, 2019
- Elevated Standoff Heights of Solder Joint Interconnections Can Result in Appreciable Stress and Warpage ReliefEphraim SuhirSung YiJennie S. HwangReza Ghaffarian
- FCCSP IMC Growth under Reliability Stress Following Automotive StandardsWei-Wei Liu (Xenia)Berdy WengJerry LiCing-Kun Yeh
- Collective Cu-Cu Thermocompression Bonding Using PillarsRobert CarrollDouglas La TulipeDouglas CoolbaughRobert Geer
- A Numerical Study on Mitigation of Flying Dies in Compression Molding of Microelectronic PackagesMarc DreissigackerOle HoelckJoerg BauerTanja BraunKarl-Friedrich BeckerMartin Schneider-RamelowKlaus-Dieter Lang
- Design of Solder Connections for Self-Assembly of Optoelectronic DevicesThomas F. MarinisJoseph W. Soucy
Carroll, Robert, Douglas La Tulipe, Douglas Coolbaugh, and Robert Geer. 2019. “Collective Cu-Cu Thermocompression Bonding Using Pillars.” Journal of Microelectronics and Electronic Packaging 16 (1): 28–38. https://doi.org/10.4071/imaps.741710.