ISSN 1551-4897
Vol. 16, Issue 1, 2019January 01, 2019 EDT
FCCSP IMC Growth under Reliability Stress Following Automotive Standards
FCCSP IMC Growth under Reliability Stress Following Automotive Standards
Articles in Vol. 16, Issue 1, 2019
Vol. 16, Issue 1, 2019
- Elevated Standoff Heights of Solder Joint Interconnections Can Result in Appreciable Stress and Warpage ReliefEphraim SuhirSung YiJennie S. HwangReza Ghaffarian
- FCCSP IMC Growth under Reliability Stress Following Automotive StandardsWei-Wei Liu (Xenia)Berdy WengJerry LiCing-Kun Yeh
- Collective Cu-Cu Thermocompression Bonding Using PillarsRobert CarrollDouglas La TulipeDouglas CoolbaughRobert Geer
- A Numerical Study on Mitigation of Flying Dies in Compression Molding of Microelectronic PackagesMarc DreissigackerOle HoelckJoerg BauerTanja BraunKarl-Friedrich BeckerMartin Schneider-RamelowKlaus-Dieter Lang
- Design of Solder Connections for Self-Assembly of Optoelectronic DevicesThomas F. MarinisJoseph W. Soucy
Liu (Xenia), Wei-Wei, Berdy Weng, Jerry Li, and Cing-Kun Yeh. 2019. “FCCSP IMC Growth under Reliability Stress Following Automotive Standards.” Journal of Microelectronics and Electronic Packaging 16 (1): 21–27. https://doi.org/10.4071/imaps.735545.