ISSN 1551-4897
Vol. 16, Issue 3, 2019July 01, 2019 EDT
Design and Demonstration of Glass Panel Embedding for 3D System Packages for Heterogeneous Integration Applications
Design and Demonstration of Glass Panel Embedding for 3D System Packages for Heterogeneous Integration Applications
Articles in Vol. 16, Issue 3, 2019
Vol. 16, Issue 3, 2019
- Process Design Kit and Design Automation for Flexible Hybrid ElectronicsTsung-Ching HuangTing LeiLeilai ShaoSridhar SivapurapuMadhavan SwaminathanZhenan BaoKwang-Ting ChengRaymond Beausoleil
- Design and Demonstration of Glass Panel Embedding for 3D System Packages for Heterogeneous Integration ApplicationsSiddharth RavichandranShuhei YamadaTomonori OgawaTailong ShiFuhan LiuVanessa SmetVenky SundaramRao Tummala
- Moisture-Resistant Sealing Materials for Downhole HPHT Electrical Feedthrough PackageHua XiaNelson SettlesDavid DeWire
- Fabrication of Three-Dimensional Piezoelectric Ceramics Using the Dispenser SystemShuto MatsudaTadashi FujiiNaoya NakadaTomoaki KarakiTatsunori Kakuda
- A Capacitive Pressure Sensor Based on Cofirable Ceramic/Glass Materials with LTCC TechnologyYue LiuYuanxun LiYongcheng LuHua SuZhihua TaoMingzhou ChenDaming Chen
Ravichandran, Siddharth, Shuhei Yamada, Tomonori Ogawa, Tailong Shi, Fuhan Liu, Vanessa Smet, Venky Sundaram, and Rao Tummala. 2019. “Design and Demonstration of Glass Panel Embedding for 3D System Packages for Heterogeneous Integration Applications.” Journal of Microelectronics and Electronic Packaging 16 (3): 124–35. https://doi.org/10.4071/imaps.930748.