ISSN 1551-4897
Vol. 16, Issue 3, 2019July 01, 2019 EDT
Process Design Kit and Design Automation for Flexible Hybrid Electronics
Process Design Kit and Design Automation for Flexible Hybrid Electronics
Tsung-Ching Huang, Ting Lei, Leilai Shao, Sridhar Sivapurapu, Madhavan Swaminathan, Zhenan Bao, Kwang-Ting Cheng, Raymond Beausoleil,
Articles in Vol. 16, Issue 3, 2019
Vol. 16, Issue 3, 2019
- Process Design Kit and Design Automation for Flexible Hybrid ElectronicsTsung-Ching HuangTing LeiLeilai ShaoSridhar SivapurapuMadhavan SwaminathanZhenan BaoKwang-Ting ChengRaymond Beausoleil
- Design and Demonstration of Glass Panel Embedding for 3D System Packages for Heterogeneous Integration ApplicationsSiddharth RavichandranShuhei YamadaTomonori OgawaTailong ShiFuhan LiuVanessa SmetVenky SundaramRao Tummala
- Moisture-Resistant Sealing Materials for Downhole HPHT Electrical Feedthrough PackageHua XiaNelson SettlesDavid DeWire
- Fabrication of Three-Dimensional Piezoelectric Ceramics Using the Dispenser SystemShuto MatsudaTadashi FujiiNaoya NakadaTomoaki KarakiTatsunori Kakuda
- A Capacitive Pressure Sensor Based on Cofirable Ceramic/Glass Materials with LTCC TechnologyYue LiuYuanxun LiYongcheng LuHua SuZhihua TaoMingzhou ChenDaming Chen
Huang, Tsung-Ching, Ting Lei, Leilai Shao, Sridhar Sivapurapu, Madhavan Swaminathan, Zhenan Bao, Kwang-Ting Cheng, and Raymond Beausoleil. 2019. “Process Design Kit and Design Automation for Flexible Hybrid Electronics.” Journal of Microelectronics and Electronic Packaging 16 (3): 117–23. https://doi.org/10.4071/imaps.925849.