ISSN 1551-4897
Vol. 18, Issue 2, 2021April 01, 2021 EDT
The Effect of Cu Target Pad Roughness and Solution Flow on the Growth Mode and Void Formation in Electroless Cu Films
The Effect of Cu Target Pad Roughness and Solution Flow on the Growth Mode and Void Formation in Electroless Cu Films
Articles in Vol. 18, Issue 2, 2021
Vol. 18, Issue 2, 2021
- Thermal Cycling Test and Simulation of Fan-Out Chip-Last Panel-Level Packaging for Heterogeneous IntegrationJohn H LauCheng-Ta KoChia-Yu PengKai-Ming YangTim XiaPuru Bruce LinJean-Jou ChenPo-Chun HuangTzvy-Jang TsengEagle LinLeo ChangCurry LinYan-Jun FanHsing-Ning LiuWinnie Lu
- Electroless Plating with UV Modification for Thermosetting Dielectric and Decay Suppression of High Frequency Transmission PropertyMasaya TobaKazuyuki MitsukuraMasaki Yamaguchi
- The Effect of Cu Target Pad Roughness and Solution Flow on the Growth Mode and Void Formation in Electroless Cu FilmsTobias BernhardSebastian ZarwellRoger MasseyEdith SteinhäuserStefan KempaFrank Branduuml
- Multimode Bus Coupler for Device Communication Integrated in 3D-Opto-MIDLukas LorenzKrzysztof NieweglowskiKarlheinz Bock
- Thermal Cycling Test and Simulation of Six-Side Molded Panel-Level Chip-Scale Packages (PLCSPs)John H LauCheng-Ta KoChia-Yu PengTzvy-Jang TsengKai-Ming YangTim XiaPuru Bruce LinEagle LinLeo ChangHsing Ning LiuCurry LinYan-Jun FanDavid ChengWinnie Lu
Bernhard, Tobias, Sebastian Zarwell, Roger Massey, Edith Steinhäuser, Stefan Kempa, and Frank Branduuml. 2021. “The Effect of Cu Target Pad Roughness and Solution Flow on the Growth Mode and Void Formation in Electroless Cu Films.” Journal of Microelectronics and Electronic Packaging 18 (2): 40–50. https://doi.org/10.4071/imaps.1409209.