ISSN 1551-4897
Vol. 18, Issue 2, 2021April 01, 2021 EDT
Multimode Bus Coupler for Device Communication Integrated in 3D-Opto-MID
Multimode Bus Coupler for Device Communication Integrated in 3D-Opto-MID
Articles in Vol. 18, Issue 2, 2021
Vol. 18, Issue 2, 2021
- Thermal Cycling Test and Simulation of Fan-Out Chip-Last Panel-Level Packaging for Heterogeneous IntegrationJohn H LauCheng-Ta KoChia-Yu PengKai-Ming YangTim XiaPuru Bruce LinJean-Jou ChenPo-Chun HuangTzvy-Jang TsengEagle LinLeo ChangCurry LinYan-Jun FanHsing-Ning LiuWinnie Lu
- Electroless Plating with UV Modification for Thermosetting Dielectric and Decay Suppression of High Frequency Transmission PropertyMasaya TobaKazuyuki MitsukuraMasaki Yamaguchi
- The Effect of Cu Target Pad Roughness and Solution Flow on the Growth Mode and Void Formation in Electroless Cu FilmsTobias BernhardSebastian ZarwellRoger MasseyEdith SteinhäuserStefan KempaFrank Branduuml
- Multimode Bus Coupler for Device Communication Integrated in 3D-Opto-MIDLukas LorenzKrzysztof NieweglowskiKarlheinz Bock
- Thermal Cycling Test and Simulation of Six-Side Molded Panel-Level Chip-Scale Packages (PLCSPs)John H LauCheng-Ta KoChia-Yu PengTzvy-Jang TsengKai-Ming YangTim XiaPuru Bruce LinEagle LinLeo ChangHsing Ning LiuCurry LinYan-Jun FanDavid ChengWinnie Lu
Lorenz, Lukas, Krzysztof Nieweglowski, and Karlheinz Bock. 2021. “Multimode Bus Coupler for Device Communication Integrated in 3D-Opto-MID.” Journal of Microelectronics and Electronic Packaging 18 (2): 59–66. https://doi.org/10.4071/imaps.1412062.