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ISSN 1551-4897
General
Vol. 16, Issue 2, 2019April 01, 2019 EDT

Head-on-Pillow Defect Detection: X-Ray Inspection Limitations

Lars Bruno, Benny Gustafson,
Pb-free solderingBGAhead-on-pillowx-ray inspection
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.871613

Articles in Vol. 16, Issue 2, 2019

Vol. 16, Issue 2, 2019
  • Recent Advances and Trends in Heterogeneous Integrations
    John H. Lau
  • Sixty Earth-Day Test of a Prototype Pt/HTCC Alumina Package in a Simulated Venus Environment
    Liangyu ChenPhilip G. NeudeckRoger D. MeredithDorothy LukcoDavid J. SpryLeah M. NakleyKyle G. PhillipsGlenn M. BeheimGary W. Hunter
  • Experimental Studies of Electronics Cooling Capabilities at High Altitude
    Han-Yun JhangMing-Xi HoCho-Han LeeFang-Shou Lee
  • Head-on-Pillow Defect Detection: X-Ray Inspection Limitations
    Lars BrunoBenny Gustafson
  • Flexible PET Substrate for High-Definition Printing of Polymer Thick-Film Conductive Pastes
    Art Dobie
Journal of Microelectronics & Elect Pkg
Bruno, Lars, and Benny Gustafson. 2019. “Head-on-Pillow Defect Detection: X-Ray Inspection Limitations.” Journal of Microelectronics and Electronic Packaging 16 (2): 91–102. https://doi.org/10.4071/imaps.871613.
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