ISSN 1551-4897
Vol. 16, Issue 2, 2019April 01, 2019 EDT
Experimental Studies of Electronics Cooling Capabilities at High Altitude
Experimental Studies of Electronics Cooling Capabilities at High Altitude
Articles in Vol. 16, Issue 2, 2019
Vol. 16, Issue 2, 2019
- Recent Advances and Trends in Heterogeneous IntegrationsJohn H. Lau
- Sixty Earth-Day Test of a Prototype Pt/HTCC Alumina Package in a Simulated Venus EnvironmentLiangyu ChenPhilip G. NeudeckRoger D. MeredithDorothy LukcoDavid J. SpryLeah M. NakleyKyle G. PhillipsGlenn M. BeheimGary W. Hunter
- Experimental Studies of Electronics Cooling Capabilities at High AltitudeHan-Yun JhangMing-Xi HoCho-Han LeeFang-Shou Lee
- Head-on-Pillow Defect Detection: X-Ray Inspection LimitationsLars BrunoBenny Gustafson
- Flexible PET Substrate for High-Definition Printing of Polymer Thick-Film Conductive PastesArt Dobie
Jhang, Han-Yun, Ming-Xi Ho, Cho-Han Lee, and Fang-Shou Lee. 2019. “Experimental Studies of Electronics Cooling Capabilities at High Altitude.” Journal of Microelectronics and Electronic Packaging 16 (2): 84–90. https://doi.org/10.4071/imaps.871683.