ISSN 1551-4897
Vol. 16, Issue 2, 2019April 01, 2019 EDT
Recent Advances and Trends in Heterogeneous Integrations
Recent Advances and Trends in Heterogeneous Integrations
Heterogeneous integrationssystem-in-packagesubstratesmultichip modulethrough-silicon viafan-out wafer-level packaging
Articles in Vol. 16, Issue 2, 2019
Vol. 16, Issue 2, 2019
- Recent Advances and Trends in Heterogeneous IntegrationsJohn H. Lau
- Sixty Earth-Day Test of a Prototype Pt/HTCC Alumina Package in a Simulated Venus EnvironmentLiangyu ChenPhilip G. NeudeckRoger D. MeredithDorothy LukcoDavid J. SpryLeah M. NakleyKyle G. PhillipsGlenn M. BeheimGary W. Hunter
- Experimental Studies of Electronics Cooling Capabilities at High AltitudeHan-Yun JhangMing-Xi HoCho-Han LeeFang-Shou Lee
- Head-on-Pillow Defect Detection: X-Ray Inspection LimitationsLars BrunoBenny Gustafson
- Flexible PET Substrate for High-Definition Printing of Polymer Thick-Film Conductive PastesArt Dobie
Lau, John H. 2019. “Recent Advances and Trends in Heterogeneous Integrations.” Journal of Microelectronics and Electronic Packaging 16 (2): 45–77. https://doi.org/10.4071/imaps.780287.