Vol. 15, Issue 4, 2018October 01, 2018 EDT
Reliability of Fan-Out Wafer-Level Heterogeneous Integration
Reliability of Fan-Out Wafer-Level Heterogeneous Integration
Lau, John, Ming Li, Yang Lei, Margie Li, Iris Xu, Tony Chen, Qing X. Yong, et al. 2018. “Reliability of Fan-Out Wafer-Level Heterogeneous Integration.” Journal of Microelectronics and Electronic Packaging 15 (4): 148–62. https://doi.org/10.4071/imaps.728940.