ISSN 1551-4897
Vol. 15, Issue 4, 2018October 01, 2018 EDT
Reliability of Fan-Out Wafer-Level Heterogeneous Integration
Reliability of Fan-Out Wafer-Level Heterogeneous Integration
Articles in Vol. 15, Issue 4, 2018
Vol. 15, Issue 4, 2018
- Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous IntegrationCheng-Ta KoHenry YangJohn LauMing LiMargie LiCurry LinJ. W. LinChieh-Lin ChangJhih-Yuan PanHsing-Hui WuYu-Hua ChenTony ChenIris XuPenny LoNelson FanEric KuahZhang LiKim Hwee TanChia-Hung LinRozalia BeicaMarc LinCao XiSze Pei LimNing Cheng LeeMian TaoJeffery LoRicky Lee
- Year-long 500°C Operational Demonstration of Up-scaled 4H-SiC JFET Integrated CircuitsPhilip G. NeudeckDavid J. SpryMichael J. KrasowskiNorman F. ProkopGlenn M. BeheimLiang-Yu ChenCarl W. Chang
- Reliability of Fan-Out Wafer-Level Heterogeneous IntegrationJohn LauMing LiYang LeiMargie LiIris XuTony ChenQing X. YongZhong ChengWu KaiPenny LoZhang LiKim H. TanYiu Ming CheungNelson FanEric KuahCao XiJiang RanRozalia BeicaSze P. LimNing Cheng LeeCheng-Ta KoHenry YangYu-Hua ChenMian TaoJeffery LoRicky Lee
- Characterization of Low-Inductance Microcoaxial Cables for Power DistributionDaniela A. TorresAnthony KopaSara C. BarronRobert McCormickRobert D. WhiteCaprice Gray
- Screen Printing Fine Pitch Stretchable Silver Inks onto a Flexible Substrate for Wearable ApplicationsJianbiao PanMalcolm KeifJoshua LedgerwoodXiaoying RongXuan Wang
Lau, John, Ming Li, Yang Lei, Margie Li, Iris Xu, Tony Chen, Qing X. Yong, et al. 2018. “Reliability of Fan-Out Wafer-Level Heterogeneous Integration.” Journal of Microelectronics and Electronic Packaging 15 (4): 148–62. https://doi.org/10.4071/imaps.728940.