ISSN 1551-4897
Vol. 15, Issue 4, 2018October 01, 2018 EDT
Year-long 500°C Operational Demonstration of Up-scaled 4H-SiC JFET Integrated Circuits
Year-long 500°C Operational Demonstration of Up-scaled 4H-SiC JFET Integrated Circuits
Articles in Vol. 15, Issue 4, 2018
Vol. 15, Issue 4, 2018
- Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous IntegrationCheng-Ta KoHenry YangJohn LauMing LiMargie LiCurry LinJ. W. LinChieh-Lin ChangJhih-Yuan PanHsing-Hui WuYu-Hua ChenTony ChenIris XuPenny LoNelson FanEric KuahZhang LiKim Hwee TanChia-Hung LinRozalia BeicaMarc LinCao XiSze Pei LimNing Cheng LeeMian TaoJeffery LoRicky Lee
- Year-long 500°C Operational Demonstration of Up-scaled 4H-SiC JFET Integrated CircuitsPhilip G. NeudeckDavid J. SpryMichael J. KrasowskiNorman F. ProkopGlenn M. BeheimLiang-Yu ChenCarl W. Chang
- Reliability of Fan-Out Wafer-Level Heterogeneous IntegrationJohn LauMing LiYang LeiMargie LiIris XuTony ChenQing X. YongZhong ChengWu KaiPenny LoZhang LiKim H. TanYiu Ming CheungNelson FanEric KuahCao XiJiang RanRozalia BeicaSze P. LimNing Cheng LeeCheng-Ta KoHenry YangYu-Hua ChenMian TaoJeffery LoRicky Lee
- Characterization of Low-Inductance Microcoaxial Cables for Power DistributionDaniela A. TorresAnthony KopaSara C. BarronRobert McCormickRobert D. WhiteCaprice Gray
- Screen Printing Fine Pitch Stretchable Silver Inks onto a Flexible Substrate for Wearable ApplicationsJianbiao PanMalcolm KeifJoshua LedgerwoodXiaoying RongXuan Wang
Neudeck, Philip G., David J. Spry, Michael J. Krasowski, Norman F. Prokop, Glenn M. Beheim, Liang-Yu Chen, and Carl W. Chang. 2018. “Year-Long 500°C Operational Demonstration of Up-Scaled 4H-SiC JFET Integrated Circuits.” Journal of Microelectronics and Electronic Packaging 15 (4): 163–70. https://doi.org/10.4071/imaps.729648.