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Vol. 18, Issue 2, 2021April 01, 2021 EDT

Multimode Bus Coupler for Device Communication Integrated in 3D-Opto-MID

Lukas Lorenz, Krzysztof Nieweglowski, Karlheinz Bock,
Optical bus couplerasymmetric couplingdirectional couplingthree-dimensional packagedevice communication
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.1412062
Journal of Microelectronics & Elect Pkg
Lorenz, Lukas, Krzysztof Nieweglowski, and Karlheinz Bock. 2021. “Multimode Bus Coupler for Device Communication Integrated in 3D-Opto-MID.” Journal of Microelectronics and Electronic Packaging 18 (2): 59–66. https:/​/​doi.org/​10.4071/​imaps.1412062.
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