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Vol. 2, Issue 4, 2005October 01, 2005 EDT

Experimental Evaluation of Glob-top Materials for use in Harsh Environments

Mats Lindgren, Ilja Belov, Peter Leisner,
AdhesionEncapsulantFoggingGlob-topMulti-attribute decision makingMulti-Chip-Module (MCM)Outgassing
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/1551-4897-2.4.253
Journal of Microelectronics & Elect Pkg
Lindgren, Mats, Ilja Belov, and Peter Leisner. 2005. “Experimental Evaluation of Glob-Top Materials for Use in Harsh Environments.” Journal of Microelectronics and Electronic Packaging 2 (4): 253–68. https:/​/​doi.org/​10.4071/​1551-4897-2.4.253.
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