ISSN 1551-4897
Vol. 2, Issue 3, 2005July 01, 2005 EDT
Pretreatment of Blind Via Holes before Ni/Au and Cu Plating Applied with Atmospheric Pressure Plasma Jet
Pretreatment of Blind Via Holes before Ni/Au and Cu Plating Applied with Atmospheric Pressure Plasma Jet
Articles in Vol. 2, Issue 3, 2005
Vol. 2, Issue 3, 2005
- Interfacial Stresses in a Tri-Material Assembly Subjected to Differential Temperatures in the Layers in Electronic PackagingD. SujanM. V. V. MurthyK. N. SeetharamuA. Y. Hassan
- Design of Drop Test Apparatus for Electronic PackagesChang-Lin YehYi-Shao Lai
- Board Level Power Cycling and Thermal Cycling Fatigue Reliability of Chip-scale PackagesTong Hong WangYi-Shao LaiChang-Chi Lee
- Pretreatment of Blind Via Holes before Ni/Au and Cu Plating Applied with Atmospheric Pressure Plasma JetYasushi SawadaKeiichi YamazakiNoriyuki TaguchiTetsuji Shibata
- Soldering Properties and Interfacial Microstructure of CSP Solder Joints with Lower Melting Lead-free SolderAtsushi YamaguchiYuhei YamashitaAkio FurusawaKazuto NishidaTakashi HojoYosuke SogoAyako MiwaAkio HiroseKojiro F. Kobayashi
- Study of Interfacial Delamination by Considering the Effect of Temperature and Moisture during Solder Reflow for QFN PackageFu-Mauh WongK.N Seetharamu
- Lead Free Die Mount Adhesive Using Silver Nanoparticles Applied To Power Discrete PackageYasunari UkitaKazuki TateyamaMasao SegawaYoshihiko TojoHideyuki GotohKatsuhisa Oosako
Sawada, Yasushi, Keiichi Yamazaki, Noriyuki Taguchi, and Tetsuji Shibata. 2005. “Pretreatment of Blind Via Holes before Ni/Au and Cu Plating Applied with Atmospheric Pressure Plasma Jet.” Journal of Microelectronics and Electronic Packaging 2 (3): 189–96. https://doi.org/10.4071/1551-4897-2.3.189.