ISSN 1551-4897
Vol. 17, Issue 4, 2020October 01, 2020 EDT
Reliable Nickel-Free Surface Finish Solution for High-Frequency, HDI PCB Applications
Reliable Nickel-Free Surface Finish Solution for High-Frequency, HDI PCB Applications
Articles in Vol. 17, Issue 4, 2020
Vol. 17, Issue 4, 2020
- Six-Side Molded Panel-Level Chip-Scale Package with Multiple Diced WafersJohn H. LauCheng-Ta KoTzvy-Jang TsengChia-Yu PengKai-Ming YangTim XiaPuru Bruce LinEagle LinLeo ChangHsing Ning LiuCurry LinDavid ChengWinnie Lu
- Reliable Nickel-Free Surface Finish Solution for High-Frequency, HDI PCB ApplicationsKunal Shah
- Optimization of PCB SI Coupon Design That Minimizes Discontinuity Through via-in-Pad Plated over (VIPPO) TechniqueJuhee LeeKyeongsoo KimSimon KimKiseop KimKyungsoo Lee
Shah, Kunal. 2020. “Reliable Nickel-Free Surface Finish Solution for High-Frequency, HDI PCB Applications.” Journal of Microelectronics and Electronic Packaging 17 (4): 121–27. https://doi.org/10.4071/imaps.1227802.