ISSN 1551-4897
Vol. 17, Issue 4, 2020October 01, 2020 EDT
Optimization of PCB SI Coupon Design That Minimizes Discontinuity Through via-in-Pad Plated over (VIPPO) Technique
Optimization of PCB SI Coupon Design That Minimizes Discontinuity Through via-in-Pad Plated over (VIPPO) Technique
Articles in Vol. 17, Issue 4, 2020
Vol. 17, Issue 4, 2020
- Six-Side Molded Panel-Level Chip-Scale Package with Multiple Diced WafersJohn H. LauCheng-Ta KoTzvy-Jang TsengChia-Yu PengKai-Ming YangTim XiaPuru Bruce LinEagle LinLeo ChangHsing Ning LiuCurry LinDavid ChengWinnie Lu
- Reliable Nickel-Free Surface Finish Solution for High-Frequency, HDI PCB ApplicationsKunal Shah
- Optimization of PCB SI Coupon Design That Minimizes Discontinuity Through via-in-Pad Plated over (VIPPO) TechniqueJuhee LeeKyeongsoo KimSimon KimKiseop KimKyungsoo Lee
Lee, Juhee, Kyeongsoo Kim, Simon Kim, Kiseop Kim, and Kyungsoo Lee. 2020. “Optimization of PCB SI Coupon Design That Minimizes Discontinuity Through Via-in-Pad Plated over (VIPPO) Technique.” Journal of Microelectronics and Electronic Packaging 17 (4): 128–37. https://doi.org/10.4071/imaps.1227889.