ISSN 1551-4897
Vol. 2, Issue 1, 2005January 01, 2005 EDT
Modified-Amine Cured Epoxy Formulation For The Encapsulation Of Electronic Circuits
Modified-Amine Cured Epoxy Formulation For The Encapsulation Of Electronic Circuits
Articles in Vol. 2, Issue 1, 2005
Vol. 2, Issue 1, 2005
- Laser forming of LTCC Ceramics for Hot-Plate Gas SensorsJaroslaw KitaFrank RettigRalf MoosKarl-Heinz DrüeHeiko Thust
- New Trim Configurations for Laser Trimmed Thick-Film Resistors – Experimental VerificationSlawomir KaminskiEdward MisMaciej SzymenderaAndrzej Dziedzic
- Screen-Printed Fe2O3/ZnO thick films for gas sensing applicationsK. ArshakI. GaidanL. Cavanagh
- Investigation of Steady State and Transient Thermal Management in Portable Telecommunication Product – Part 1Cheang Soon YeeK.N. SeetharamuG.A. QuadirZ.A. Zainal
- Modified-Amine Cured Epoxy Formulation For The Encapsulation Of Electronic CircuitsGilberto RinaldiAlessia CatalaniGiulio RubiniDaniele Surace
- Modeling Thermal Behavior of System-in-Package with Dynamic Compact ModelKimmo KaijaPekka HeinoEero O. Ristolainen
- Lead-free Solder Joint Reliability – State of the Art and PerspectivesJianbiao PanJyhwen WangDavid M. Shaddock
- Advanced Assembly Techniques For Silicon SensorsZbigniew SzczepańskiJerzy Kalenik
- A New Method of Determining the Thermal Resistance of Microelectronic PackagesKing-Long TeohK.N. SeetharamuAhmad Yusoff Hassan
- Smart and Sequential Approach to Numerical Prototyping in Micro-Electronic ApplicationsA. WymysłowskiW.D. van DrielG.Q. ZhangJ. van de PeerN. Tzannetakis
Rinaldi, Gilberto, Alessia Catalani, Giulio Rubini, and Daniele Surace. 2005. “Modified-Amine Cured Epoxy Formulation For The Encapsulation Of Electronic Circuits.” Journal of Microelectronics and Electronic Packaging 2 (1): 55–63. https://doi.org/10.4071/1551-4897-2.1.55.