ISSN 1551-4897
Vol. 2, Issue 1, 2005January 01, 2005 EDT
Smart and Sequential Approach to Numerical Prototyping in Micro-Electronic Applications
Smart and Sequential Approach to Numerical Prototyping in Micro-Electronic Applications
Articles in Vol. 2, Issue 1, 2005
Vol. 2, Issue 1, 2005
- Laser forming of LTCC Ceramics for Hot-Plate Gas SensorsJaroslaw KitaFrank RettigRalf MoosKarl-Heinz DrüeHeiko Thust
- New Trim Configurations for Laser Trimmed Thick-Film Resistors – Experimental VerificationSlawomir KaminskiEdward MisMaciej SzymenderaAndrzej Dziedzic
- Screen-Printed Fe2O3/ZnO thick films for gas sensing applicationsK. ArshakI. GaidanL. Cavanagh
- Investigation of Steady State and Transient Thermal Management in Portable Telecommunication Product – Part 1Cheang Soon YeeK.N. SeetharamuG.A. QuadirZ.A. Zainal
- Modified-Amine Cured Epoxy Formulation For The Encapsulation Of Electronic CircuitsGilberto RinaldiAlessia CatalaniGiulio RubiniDaniele Surace
- Modeling Thermal Behavior of System-in-Package with Dynamic Compact ModelKimmo KaijaPekka HeinoEero O. Ristolainen
- Lead-free Solder Joint Reliability – State of the Art and PerspectivesJianbiao PanJyhwen WangDavid M. Shaddock
- Advanced Assembly Techniques For Silicon SensorsZbigniew SzczepańskiJerzy Kalenik
- A New Method of Determining the Thermal Resistance of Microelectronic PackagesKing-Long TeohK.N. SeetharamuAhmad Yusoff Hassan
- Smart and Sequential Approach to Numerical Prototyping in Micro-Electronic ApplicationsA. WymysłowskiW.D. van DrielG.Q. ZhangJ. van de PeerN. Tzannetakis
Wymysłowski, A., W.D. van Driel, G.Q. Zhang, J. van de Peer, and N. Tzannetakis. 2005. “Smart and Sequential Approach to Numerical Prototyping in Micro-Electronic Applications.” Journal of Microelectronics and Electronic Packaging 2 (1): 1–7. https://doi.org/10.4071/1551-4897-2.1.1.