ISSN 1551-4897
Vol. 1, Issue 2, 2004April 01, 2004 EDT
Influence Of Solder Joint Shape On The Thermo-Mechanical Reliability Of CSP’s
Influence Of Solder Joint Shape On The Thermo-Mechanical Reliability Of CSP’s
α = shape parameter for bumpabc = parameters defining the plane of the chipEo = minimum surface energyEf = surface energy of compressed bumpE(x) = surface energy as function of displacement in x directionFEM = finite element model(-ing)g = gravitational constanthf = height of bump under loadj = dimensionless parameterk = equilibrium height of bump (no weight applied)Kxy = force constant for movement in the xy directionKz = force constant for movement in the z directionKmax = maximum value for the force constant in the z direction for p=qKi(ki) = force constant as function of the equilibrium height of the bumpN50% = number of cycles to 50% failuresM = mass of the chip per bumpO(h) = surface of bump as function of hp = radius of solderpad for connection on first sideq = radius of solderpad for connection on second sidero = radius at the equator of the bumpr(z) = cylindrical radius of bump as function of zt = intermediate variableu = dimensionless parameterV = volume of bumpγ = surface energy constantΔεinel = inelastic strain per cycle (inelastic strain = sum of plastic and creep strain)
Articles in Vol. 1, Issue 2, 2004
Vol. 1, Issue 2, 2004
- Creep Characterization Of Ceramic BGALewis S. GoldmannMukta Farooq
- Planarization and Dielectric Properties of Thin Photosensitive and Nonphotosensitive BCBBrian DuschPaul A. Kohl
- Influence Of Solder Joint Shape On The Thermo-Mechanical Reliability Of CSP'sCo van VeenBart VandeveldeEric Beyne
- An Application for Superelastic Material in a Passive Inertial Damage Sensor for Detection of Conditions Leading to the Accumulation of Hidden Structural Damage Caused by Transient Loading in Aircraft The ConceptionJ. HoffmanR. Jeffers
- Epoxies for OptoElectronic Packaging; Applications and Material PropertiesMichael J. Hodgin
- Board Level Reliability Enhancement for A Double-bump Wafer Level Chip Scale PackageXiaowu ZhangE. H. WongMahadevan K. Iyer
- Study of Thermal Effect of Power Circuit on Driver & Protection PCB in Hybrid IPEMYu XiaolingXiong WeiZhou WeiFeng Quanke
Veen, Co van, Bart Vandevelde, and Eric Beyne. 2004. “Influence Of Solder Joint Shape On The Thermo-Mechanical Reliability Of CSP’s.” Journal of Microelectronics and Electronic Packaging 1 (2): 53–63. https://doi.org/10.4071/1551-4897-1.2.53.