ISSN 1551-4897
Vol. 1, Issue 2, 2004April 01, 2004 EDT
Epoxies for OptoElectronic Packaging; Applications and Material Properties
Epoxies for OptoElectronic Packaging; Applications and Material Properties
Articles in Vol. 1, Issue 2, 2004
Vol. 1, Issue 2, 2004
- Creep Characterization Of Ceramic BGALewis S. GoldmannMukta Farooq
- Planarization and Dielectric Properties of Thin Photosensitive and Nonphotosensitive BCBBrian DuschPaul A. Kohl
- Influence Of Solder Joint Shape On The Thermo-Mechanical Reliability Of CSP'sCo van VeenBart VandeveldeEric Beyne
- An Application for Superelastic Material in a Passive Inertial Damage Sensor for Detection of Conditions Leading to the Accumulation of Hidden Structural Damage Caused by Transient Loading in Aircraft The ConceptionJ. HoffmanR. Jeffers
- Epoxies for OptoElectronic Packaging; Applications and Material PropertiesMichael J. Hodgin
- Board Level Reliability Enhancement for A Double-bump Wafer Level Chip Scale PackageXiaowu ZhangE. H. WongMahadevan K. Iyer
- Study of Thermal Effect of Power Circuit on Driver & Protection PCB in Hybrid IPEMYu XiaolingXiong WeiZhou WeiFeng Quanke
Hodgin, Michael J. 2004. “Epoxies for OptoElectronic Packaging; Applications and Material Properties.” Journal of Microelectronics and Electronic Packaging 1 (2): 108–16. https://doi.org/10.4071/1551-4897-1.2.108.