ISSN 1551-4897
Vol. 1, Issue 2, 2004April 01, 2004 EDT
Study of Thermal Effect of Power Circuit on Driver & Protection PCB in Hybrid IPEM
Study of Thermal Effect of Power Circuit on Driver & Protection PCB in Hybrid IPEM
Xiaoling, Yu, Xiong Wei, Zhou Wei, and Feng Quanke. 2004. “Study of Thermal Effect of Power Circuit on Driver & Protection PCB in Hybrid IPEM.” Journal of Microelectronics and Electronic Packaging 1 (2): 95–101. https://doi.org/10.4071/1551-4897-1.2.95.