ISSN 1551-4897
Articles in Vol. 1, Issue 1, 2004
Vol. 1, Issue 1, 2004
- Thermal Investigation of GaAs Microwave Power TransistorsG. HanreichM. MayerM. MündleinJ. Nicolics
- Prediction of Microelectronics Thermal Behavior in Electronic Equipment: Status, Challenges and Future RequirementsPeter Rodgers
- An Approach To Numerical Simulation Of Thermal Contact Problems In Modern Electronic PackagesK. FriedelA. Wymyslowski
- Extraction of a Dynamic Multiport Compact Thermal Model for a Silicon MicrothrusterM. SallerasJ. PalacinI. GarcíaM. PuigJ. SamitierS. Marco
- Board Via Effect On Thermal Performance Of A Leadless PackageHeinz PapeKay SchillerRudolf Kutscherauer
Hanreich, G., M. Mayer, M. Mündlein, and J. Nicolics. 2004. “Thermal Investigation of GaAs Microwave Power Transistors.” Journal of Microelectronics and Electronic Packaging 1 (1): 1–8. https://doi.org/10.4071/1551-4897-1.1.1.