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Vol. 1, Issue 1, 2004January 01, 2004 EDT

Prediction of Microelectronics Thermal Behavior in Electronic Equipment: Status, Challenges and Future Requirements

Peter Rodgers,
thermalpredictive techniquesmodelingcomputational fluid dynamicsCFDintegrated circuit
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/1551-4897-1.1.16
Journal of Microelectronics & Elect Pkg
Rodgers, Peter. 2004. “Prediction of Microelectronics Thermal Behavior in Electronic Equipment: Status, Challenges and Future Requirements.” Journal of Microelectronics and Electronic Packaging 1 (1): 16–29. https:/​/​doi.org/​10.4071/​1551-4897-1.1.16.
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