ISSN 1551-4897
Vol. 1, Issue 1, 2004January 01, 2004 EDT
Board Via Effect On Thermal Performance Of A Leadless Package
Board Via Effect On Thermal Performance Of A Leadless Package
Articles in Vol. 1, Issue 1, 2004
Vol. 1, Issue 1, 2004
- Thermal Investigation of GaAs Microwave Power TransistorsG. HanreichM. MayerM. MündleinJ. Nicolics
- Prediction of Microelectronics Thermal Behavior in Electronic Equipment: Status, Challenges and Future RequirementsPeter Rodgers
- An Approach To Numerical Simulation Of Thermal Contact Problems In Modern Electronic PackagesK. FriedelA. Wymyslowski
- Extraction of a Dynamic Multiport Compact Thermal Model for a Silicon MicrothrusterM. SallerasJ. PalacinI. GarcíaM. PuigJ. SamitierS. Marco
- Board Via Effect On Thermal Performance Of A Leadless PackageHeinz PapeKay SchillerRudolf Kutscherauer
Pape, Heinz, Kay Schiller, and Rudolf Kutscherauer. 2004. “Board Via Effect On Thermal Performance Of A Leadless Package.” Journal of Microelectronics and Electronic Packaging 1 (1): 9–15. https://doi.org/10.4071/1551-4897-1.1.9.