ISSN 1551-4897
Vol. 1, Issue 1, 2004January 01, 2004 EDT
An Approach To Numerical Simulation Of Thermal Contact Problems In Modern Electronic Packages
An Approach To Numerical Simulation Of Thermal Contact Problems In Modern Electronic Packages
Articles in Vol. 1, Issue 1, 2004
Vol. 1, Issue 1, 2004
- Thermal Investigation of GaAs Microwave Power TransistorsG. HanreichM. MayerM. MündleinJ. Nicolics
- Prediction of Microelectronics Thermal Behavior in Electronic Equipment: Status, Challenges and Future RequirementsPeter Rodgers
- An Approach To Numerical Simulation Of Thermal Contact Problems In Modern Electronic PackagesK. FriedelA. Wymyslowski
- Extraction of a Dynamic Multiport Compact Thermal Model for a Silicon MicrothrusterM. SallerasJ. PalacinI. GarcíaM. PuigJ. SamitierS. Marco
- Board Via Effect On Thermal Performance Of A Leadless PackageHeinz PapeKay SchillerRudolf Kutscherauer
Friedel, K., and A. Wymyslowski. 2004. “An Approach To Numerical Simulation Of Thermal Contact Problems In Modern Electronic Packages.” Journal of Microelectronics and Electronic Packaging 1 (1): 39–46. https://doi.org/10.4071/1551-4897-1.1.39.