ISSN 1551-4897
Vol. 12, Issue 2, 2015April 01, 2015 EDT
Automatic Segmentation Method for Segmenting PBGA Package and PWB Regions During Warpage Measurement of Unpainted PWB Assembly
Automatic Segmentation Method for Segmenting PBGA Package and PWB Regions During Warpage Measurement of Unpainted PWB Assembly
Articles in Vol. 12, Issue 2, 2015
Vol. 12, Issue 2, 2015
- Automatic Segmentation Method for Segmenting PBGA Package and PWB Regions During Warpage Measurement of Unpainted PWB AssemblySungbum KangI. Charles Ume
- Enabling Manufacturable 3-D Technology and Ecosystems Using a 28-nm FPGA With Stacked Silicon Interconnect TechnologyWoon-Seong KwonMyongseob KimJonathan ChangSuresh RamalingamLiam MaddenGenie TsaiStephen TsengJ.Y. LaiTerren LuSteve Chiu
- Laser Ablation of Thin Films on Low Temperature Cofired CeramicM. A. GirardiK. A. PetersonP. T. ViancoR. GrondinD. Wieliczka
- Comparison of Different Methods for Stress and Deflection Analysis in Embedded Die Packages During the Assembly ProcessK. MacurovaR. BermejoM. PletzR. SchöngrundnerT. AntretterT. KrivecM. MorianzM. BrizouxA. Lecavelier
- The Impact of Hydrogen Gas Evolution on Blister Formation in Electroless Cu FilmsTobias BernhardFrank BrüningRalf BrüningTanu SharmaDelilah BrownSebastian ZarwellCraig Bishop
- Reliability Assessment of Flip-Chip Assembly of Al BumpsHidekazu TanisawaKohei HiyamaTakeshi AnzaiHiroki TakahashiYoshinori MurakamiShinji SatoKinuyo WatanabeFumiki KatoHiroshi Sato
- Effect of Process Parameters on Free Air Ball Integrity in Copper and Palladium-Coated Copper Bonding WiresNoritoshi ArakiYasutomo IchiyamaRyo OishiTeruo HaibaraTakashi Yamada
Kang, Sungbum, and I. Charles Ume. 2015. “Automatic Segmentation Method for Segmenting PBGA Package and PWB Regions During Warpage Measurement of Unpainted PWB Assembly.” Journal of Microelectronics and Electronic Packaging 12 (2): 104–10. https://doi.org/10.4071/imaps.449.