ISSN 1551-4897
Vol. 12, Issue 2, 2015April 01, 2015 EDT
Enabling Manufacturable 3-D Technology and Ecosystems Using a 28-nm FPGA With Stacked Silicon Interconnect Technology
Enabling Manufacturable 3-D Technology and Ecosystems Using a 28-nm FPGA With Stacked Silicon Interconnect Technology
Articles in Vol. 12, Issue 2, 2015
Vol. 12, Issue 2, 2015
- Automatic Segmentation Method for Segmenting PBGA Package and PWB Regions During Warpage Measurement of Unpainted PWB AssemblySungbum KangI. Charles Ume
- Enabling Manufacturable 3-D Technology and Ecosystems Using a 28-nm FPGA With Stacked Silicon Interconnect TechnologyWoon-Seong KwonMyongseob KimJonathan ChangSuresh RamalingamLiam MaddenGenie TsaiStephen TsengJ.Y. LaiTerren LuSteve Chiu
- Laser Ablation of Thin Films on Low Temperature Cofired CeramicM. A. GirardiK. A. PetersonP. T. ViancoR. GrondinD. Wieliczka
- Comparison of Different Methods for Stress and Deflection Analysis in Embedded Die Packages During the Assembly ProcessK. MacurovaR. BermejoM. PletzR. SchöngrundnerT. AntretterT. KrivecM. MorianzM. BrizouxA. Lecavelier
- The Impact of Hydrogen Gas Evolution on Blister Formation in Electroless Cu FilmsTobias BernhardFrank BrüningRalf BrüningTanu SharmaDelilah BrownSebastian ZarwellCraig Bishop
- Reliability Assessment of Flip-Chip Assembly of Al BumpsHidekazu TanisawaKohei HiyamaTakeshi AnzaiHiroki TakahashiYoshinori MurakamiShinji SatoKinuyo WatanabeFumiki KatoHiroshi Sato
- Effect of Process Parameters on Free Air Ball Integrity in Copper and Palladium-Coated Copper Bonding WiresNoritoshi ArakiYasutomo IchiyamaRyo OishiTeruo HaibaraTakashi Yamada
Kwon, Woon-Seong, Myongseob Kim, Jonathan Chang, Suresh Ramalingam, Liam Madden, Genie Tsai, Stephen Tseng, J.Y. Lai, Terren Lu, and Steve Chiu. 2015. “Enabling Manufacturable 3-D Technology and Ecosystems Using a 28-Nm FPGA With Stacked Silicon Interconnect Technology.” Journal of Microelectronics and Electronic Packaging 12 (2): 67–71. https://doi.org/10.4071/imaps.453.