ISSN 1551-4897
Vol. 12, Issue 3, 2015July 01, 2015 EDT
Bonded Ceramic-Metal Layers for Fabrication of Thermal Conduction Plates
Bonded Ceramic-Metal Layers for Fabrication of Thermal Conduction Plates
Articles in Vol. 12, Issue 3, 2015
Vol. 12, Issue 3, 2015
- New Stacked Die Interconnect Technology for High-Performance and Low-Cost FPGAWoon-Seong KwonSuresh RamalingamXin WuLiam MaddenC. Y. HuangHung-Hsien ChangChi-Hsin ChiuSteve ChiuStephen Chen
- Challenges of Scalable 2.5D IC AssemblyLiang WangCharles G. WoychikGuilian GaoGrant VillavicencioScott McGrathHong ShenSitaram Arkalgud
- Packaging Design and Assembly for Ultrahigh Energy Density MicrobatteriesCaroline K. BjuneThomas F. MarinisYet-Ming Chiang
- Bonded Ceramic-Metal Layers for Fabrication of Thermal Conduction PlatesMadhav Datta
- Warpage Evaluation of High-Temperature Sandwich-Structured Power Module for SiC Power Semiconductor DevicesTakeshi AnzaiYoshinori MurakamiShinji SatoHidekazu TanisawaKohei HiyamaHiroki TakahashiFumiki KatoHiroshi Sato
- High Shear Speed Characteristics of Sub-100 μm Low Alpha SAC105 Solder Bump Directly Fabricated on Cu Filled Through Si Via for 3D IntegrationDo Hyun JungShalu AgarwalSantosh KumarJae Pil Jung
- Impact of Grain Structure and Material Properties on Via Extrusion in 3D InterconnectsTengfei JiangChenglin WuJay ImRui HuangPaul S. Ho
- Design Considerations of High-Current Density Capacitors Micromachined for Si InterposersA. N. BealJ. TatarchuckC. B. StevensT. A. BaginskiM. C. HamiltonR. N. Dean
Datta, Madhav. 2015. “Bonded Ceramic-Metal Layers for Fabrication of Thermal Conduction Plates.” Journal of Microelectronics and Electronic Packaging 12 (3): 146–52. https://doi.org/10.4071/imaps.473.