ISSN 1551-4897
Vol. 12, Issue 3, 2015July 01, 2015 EDT
Impact of Grain Structure and Material Properties on Via Extrusion in 3D Interconnects
Impact of Grain Structure and Material Properties on Via Extrusion in 3D Interconnects
Articles in Vol. 12, Issue 3, 2015
Vol. 12, Issue 3, 2015
- New Stacked Die Interconnect Technology for High-Performance and Low-Cost FPGAWoon-Seong KwonSuresh RamalingamXin WuLiam MaddenC. Y. HuangHung-Hsien ChangChi-Hsin ChiuSteve ChiuStephen Chen
- Challenges of Scalable 2.5D IC AssemblyLiang WangCharles G. WoychikGuilian GaoGrant VillavicencioScott McGrathHong ShenSitaram Arkalgud
- Packaging Design and Assembly for Ultrahigh Energy Density MicrobatteriesCaroline K. BjuneThomas F. MarinisYet-Ming Chiang
- Bonded Ceramic-Metal Layers for Fabrication of Thermal Conduction PlatesMadhav Datta
- Warpage Evaluation of High-Temperature Sandwich-Structured Power Module for SiC Power Semiconductor DevicesTakeshi AnzaiYoshinori MurakamiShinji SatoHidekazu TanisawaKohei HiyamaHiroki TakahashiFumiki KatoHiroshi Sato
- High Shear Speed Characteristics of Sub-100 μm Low Alpha SAC105 Solder Bump Directly Fabricated on Cu Filled Through Si Via for 3D IntegrationDo Hyun JungShalu AgarwalSantosh KumarJae Pil Jung
- Impact of Grain Structure and Material Properties on Via Extrusion in 3D InterconnectsTengfei JiangChenglin WuJay ImRui HuangPaul S. Ho
- Design Considerations of High-Current Density Capacitors Micromachined for Si InterposersA. N. BealJ. TatarchuckC. B. StevensT. A. BaginskiM. C. HamiltonR. N. Dean
Jiang, Tengfei, Chenglin Wu, Jay Im, Rui Huang, and Paul S. Ho. 2015. “Impact of Grain Structure and Material Properties on Via Extrusion in 3D Interconnects.” Journal of Microelectronics and Electronic Packaging 12 (3): 118–22. https://doi.org/10.4071/imaps.456.