ISSN 1551-4897
Articles in Vol. 7, Issue 1, 2010
Vol. 7, Issue 1, 2010
- Helmholtz Resonance Based Micro Electrostatic Actuators for Compressible Gas Control: A Microjet Generator and a Gas Micro PumpHanseup KimKhalil NajafiLuis P. Bernal
- Design and Process of 3D MEMS System-in-Package (SiP)John H. Lau
- Pb-Free Synthesis: Decision Matrix as a Tool for Alloy SelectionPedro O. QuinteroRicky ValentínDavid Ma
- Reliability of Ceramic Column Grid Array (CCGA717) Interconnect Packages Under Extreme Temperatures for Space ApplicationsRajeshuni Ramesham
- Critical Issues of TSV and 3D IC IntegrationJohn H. Lau
- Interfacial Reactions Between Electrodeposited Sn-Cu, Sn-Ag-Cu Solders and Cu, Ni SubstratesChunfen HanQi LiuDouglas G. Ivey
- Design and Fabrication of MEMS Micropumps using Double Sided EtchingJumril YunasJuliana JohariA.A HamzahMimiwaty MimiwatyIlle C. GebeshuberBurhanuddin Yeop Majlis
- Development and Characterization of Tapered Silicon Etch Process by Topography Modeling for TSV ApplicationN. RanganathanA. MalarD.Y. LeeK. PrasadK.L. Pey
Lau, John H. 2010. “Design and Process of 3D MEMS System-in-Package (SiP).” Journal of Microelectronics and Electronic Packaging 7 (1): 10–15. https://doi.org/10.4071/1551-4897-7.1.10.