ISSN 1551-4897
Articles in Vol. 5, Issue 3, 2008
Vol. 5, Issue 3, 2008
- Effect of Design Factors on Microvia Reliability of Flip Chip Ball Grid Array Polymeric SubstratesDennis LeungGuna Selvaduray
- Transforming a Laser Micromachiner into a Direct-Write Tool for Electronic MaterialsAaron D. HalvorsenPooja VaidyaMatthew RobinsonDouglas L. Schulz
- Packaging MEMS Die on E-Glass SubstratesM. BlackH. BoyettN. SandersJ. WellerR. DeanR.W. JohnsonM. Kranz
- Reflection by Embedded Copper Plane and Volumetric Heating in Laser Microvia DrillingChong ZhangIslam A. SalamaYonggang LiNathaniel R. QuickAravinda Kar
- Application of Experimental and Finite Element Modal Analysis in Development of a Novel Solder Joint Inspection SystemsLizheng ZhangI. Charles Ume
- Interconnect Analysis for 80-Gbps Serial Link DesignJonathan FasigGregory RashBarbara RandallKarl FritzSteven CurrieBart McCoyPaul RiemerWendy WilkinsBarry GilbertErik Daniel
Black, M., H. Boyett, N. Sanders, J. Weller, R. Dean, R.W. Johnson, and M. Kranz. 2008. “Packaging MEMS Die on E-Glass Substrates.” Journal of Microelectronics and Electronic Packaging 5 (3): 122–25. https://doi.org/10.4071/1551-4897-5.3.122.