ISSN 1551-4897
Vol. 5, Issue 3, 2008July 01, 2008 EDT
Transforming a Laser Micromachiner into a Direct-Write Tool for Electronic Materials
Transforming a Laser Micromachiner into a Direct-Write Tool for Electronic Materials
Articles in Vol. 5, Issue 3, 2008
Vol. 5, Issue 3, 2008
- Effect of Design Factors on Microvia Reliability of Flip Chip Ball Grid Array Polymeric SubstratesDennis LeungGuna Selvaduray
- Transforming a Laser Micromachiner into a Direct-Write Tool for Electronic MaterialsAaron D. HalvorsenPooja VaidyaMatthew RobinsonDouglas L. Schulz
- Packaging MEMS Die on E-Glass SubstratesM. BlackH. BoyettN. SandersJ. WellerR. DeanR.W. JohnsonM. Kranz
- Reflection by Embedded Copper Plane and Volumetric Heating in Laser Microvia DrillingChong ZhangIslam A. SalamaYonggang LiNathaniel R. QuickAravinda Kar
- Application of Experimental and Finite Element Modal Analysis in Development of a Novel Solder Joint Inspection SystemsLizheng ZhangI. Charles Ume
- Interconnect Analysis for 80-Gbps Serial Link DesignJonathan FasigGregory RashBarbara RandallKarl FritzSteven CurrieBart McCoyPaul RiemerWendy WilkinsBarry GilbertErik Daniel
Halvorsen, Aaron D., Pooja Vaidya, Matthew Robinson, and Douglas L. Schulz. 2008. “Transforming a Laser Micromachiner into a Direct-Write Tool for Electronic Materials.” Journal of Microelectronics and Electronic Packaging 5 (3): 116–21. https://doi.org/10.4071/1551-4897-5.3.116.