ISSN 1551-4897
Articles in Vol. 5, Issue 2, 2008
Vol. 5, Issue 2, 2008
- Reliability Assessment: New Tools for the Next Generation of PackagesIsabelle BordBruno LevrierYannick DeshayesLaurent BéchouYves Ousten
- Maximum Attainable Deflections of Shape Memory Alloy-Layered MicrocantileverP. MajumderA. Bhattacharyya
- Numerical Optimization of Silicon Stacked Module for 3-D Packaging ApplicationsAkella G.K. ViswanathXiaowu ZhangY.Y. WangS.W. YoonNavas KhanVaidyanathan Kripesh
- Laser Sintering of Silver Nanomaterial on Polymer SubstratesAdeyl KhanNicholas RasmussenValery MarinovOrven F. Swenson
- Heatsink Mass Optimization Methodology for Desktop Microprocessor CoolingAli A. MerrikhMike EymanDavid B. WalshakTom DolbearSridhar Sundaram
- Study on the Effect of Stack Thickness During Encapsulation of Stacked-Chip Scale Packages (S-CSP)M. Khalil AbdullahM.Z. AbdullahM.A. MujeebuS. KamaruddinZ.M. Ariff
Khan, Adeyl, Nicholas Rasmussen, Valery Marinov, and Orven F. Swenson. 2008. “Laser Sintering of Silver Nanomaterial on Polymer Substrates.” Journal of Microelectronics and Electronic Packaging 5 (2): 77–86. https://doi.org/10.4071/1551-4897-5.2.77.