ISSN 1551-4897
Vol. 5, Issue 2, 2008April 01, 2008 EDT
Heatsink Mass Optimization Methodology for Desktop Microprocessor Cooling
Heatsink Mass Optimization Methodology for Desktop Microprocessor Cooling
Articles in Vol. 5, Issue 2, 2008
Vol. 5, Issue 2, 2008
- Reliability Assessment: New Tools for the Next Generation of PackagesIsabelle BordBruno LevrierYannick DeshayesLaurent BéchouYves Ousten
- Maximum Attainable Deflections of Shape Memory Alloy-Layered MicrocantileverP. MajumderA. Bhattacharyya
- Numerical Optimization of Silicon Stacked Module for 3-D Packaging ApplicationsAkella G.K. ViswanathXiaowu ZhangY.Y. WangS.W. YoonNavas KhanVaidyanathan Kripesh
- Laser Sintering of Silver Nanomaterial on Polymer SubstratesAdeyl KhanNicholas RasmussenValery MarinovOrven F. Swenson
- Heatsink Mass Optimization Methodology for Desktop Microprocessor CoolingAli A. MerrikhMike EymanDavid B. WalshakTom DolbearSridhar Sundaram
- Study on the Effect of Stack Thickness During Encapsulation of Stacked-Chip Scale Packages (S-CSP)M. Khalil AbdullahM.Z. AbdullahM.A. MujeebuS. KamaruddinZ.M. Ariff
Merrikh, Ali A., Mike Eyman, David B. Walshak, Tom Dolbear, and Sridhar Sundaram. 2008. “Heatsink Mass Optimization Methodology for Desktop Microprocessor Cooling.” Journal of Microelectronics and Electronic Packaging 5 (2): 87–93. https://doi.org/10.4071/1551-4897-5.2.87.