ISSN 1551-4897
Vol. 3, Issue 4, 2006October 01, 2006 EDT
Acceleration Factor to relate Thermal Cycles to Power Cycles for Ceramic Ball Grid Area Array Packages
Acceleration Factor to relate Thermal Cycles to Power Cycles for Ceramic Ball Grid Area Array Packages
Articles in Vol. 3, Issue 4, 2006
Vol. 3, Issue 4, 2006
- MEMS Technologies and Devices for Single-Chip RF Front-EndsClark T.-C. Nguyen
- Acceleration Factor to relate Thermal Cycles to Power Cycles for Ceramic Ball Grid Area Array PackagesAndy PerkinsKrishna TungaSuresh Sitaraman
- LTCC Post Load CellMário R. Gongora-RubioM. RobertiZ M. da RochaL Fraigi
- Methods for Reducing Power Loss in On-Wafer InductorsPäivi H. KarjalainenPekka Heino
- Analysis of Embedded Baluns in 3D PackagesMatti MäntysaloPekka Heino
- Fabrication and Testing of a Micromirror Device Actuated by PZT Thin FilmsZ.M. XiaoB.J. ChenH. Fan
- Electrical Characterization of FCBGA Package Based on Measurement Approach for High-speed SOC ApplicationsMing-Kun ChenCheng-Chi TaiYu-Jung Huang
Perkins, Andy, Krishna Tunga, and Suresh Sitaraman. 2006. “Acceleration Factor to Relate Thermal Cycles to Power Cycles for Ceramic Ball Grid Area Array Packages.” Journal of Microelectronics and Electronic Packaging 3 (4): 177–93. https://doi.org/10.4071/1551-4897-3.4.177.