ISSN 1551-4897
Vol. 20, Issue 2, 2023April 01, 2023 EDT
Investigation into Impact of Redistribution Layer Design on Thermomechanical Stress in Embedded-Die Package
Investigation into Impact of Redistribution Layer Design on Thermomechanical Stress in Embedded-Die Package
Articles in Vol. 20, Issue 2, 2023
Vol. 20, Issue 2, 2023
- State-of-the-Art in Chiplets Horizontal CommunicationsJohn H. Lau
- Investigation into Impact of Redistribution Layer Design on Thermomechanical Stress in Embedded-Die PackageMasamitsu MatsuuraTanemasa AsanoHaruichi Kanaya
- Double-Sided Integrated GaN Power Module with Double Pulse Test (DPT) VerificationSourish S. SinhaTzu-Hsuan ChengDouglas C. Hopkins
- A Drop-In High-Temperature Pb-Free Solder Paste That Outperforms High-Pb Pastes in Power Discrete ApplicationsHongwen ZhangTyler RichmondKyle AserianSamuel LytwynecTybarius HarterDiego Prado
Matsuura, Masamitsu, Tanemasa Asano, and Haruichi Kanaya. 2023. “Investigation into Impact of Redistribution Layer Design on Thermomechanical Stress in Embedded-Die Package.” Journal of Microelectronics and Electronic Packaging 20 (2): 65–70. https://doi.org/10.4071/001c.81979.