ISSN 1551-4897
Vol. 20, Issue 2, 2023April 01, 2023 EDT
A Drop-In High-Temperature Pb-Free Solder Paste That Outperforms High-Pb Pastes in Power Discrete Applications
A Drop-In High-Temperature Pb-Free Solder Paste That Outperforms High-Pb Pastes in Power Discrete Applications
Articles in Vol. 20, Issue 2, 2023
Vol. 20, Issue 2, 2023
- State-of-the-Art in Chiplets Horizontal CommunicationsJohn H. Lau
- Investigation into Impact of Redistribution Layer Design on Thermomechanical Stress in Embedded-Die PackageMasamitsu MatsuuraTanemasa AsanoHaruichi Kanaya
- Double-Sided Integrated GaN Power Module with Double Pulse Test (DPT) VerificationSourish S. SinhaTzu-Hsuan ChengDouglas C. Hopkins
- A Drop-In High-Temperature Pb-Free Solder Paste That Outperforms High-Pb Pastes in Power Discrete ApplicationsHongwen ZhangTyler RichmondKyle AserianSamuel LytwynecTybarius HarterDiego Prado
Zhang, Hongwen, Tyler Richmond, Kyle Aserian, Samuel Lytwynec, Tybarius Harter, and Diego Prado. 2023. “A Drop-In High-Temperature Pb-Free Solder Paste That Outperforms High-Pb Pastes in Power Discrete Applications.” Journal of Microelectronics and Electronic Packaging 20 (2): 82` – 87. https://doi.org/10.4071/001c.81981.